Core_EDA

# Cutting edge paper sharing

## Software cutting edge

Level Db 介绍 (From WangYang Xiong 202302) attachment:"leveldb_introduction.pptx"

## EDA cutting edge

### Paper sharing guidelines:

How to do research? Let's learn from Newton: The Discovery That Transformed Pi

https://www.youtube.com/watch?v=gMlf1ELvRzc (Ask Jun for mp4 if you can't bypass gfw)

Read this guideline <u>**BEFORE your write slides!!!!!**</u> (attachment:"paper_share_gl.pptx" and example:  attachment:"paper_share_gl_exp.pptx")

A brief introduction on paper writing, reviewing procedure (from Nature editor) attachment:"how_to_write_nature_paper.pptx"

### Top professor link

Prof. Najm (From Jason) https://www.eecg.utoronto.ca/~najm/pubs.html 

Prof. BeiYu https://appsrv.cse.cuhk.edu.hk/~byu/publications.html

### OpenRoad EDA tool chain

Main repo: https://openroad.readthedocs.io/en/latest/main/src/psm/README.html

### Open EMIR tool: PDNSim

PDNSim is an open-source static IR analyzer. Features:

Report worst IR drop.

Report worst current density over all nodes and wire segments in the power distribution network, g iven a placed and PDN-synthesized design.

Check for floating PDN stripes on the power and ground nets.

Spice netlist writer for power distribution network wire segments.

## Top conferences and journals

### Conference:

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|Design Automation Conference|DAC|https://www.sigda.org/publications/dac-20 19-toc/|

|Design, Automate, and Test in Europe|DATE|https://www.date-conference.com/|

|International Conference on Computer Aided Design|ICCAD|https://www.sigda.org/publications/iccad-2 019-toc/|

|Asia South Pacific Design Automation Conference|ASPDAC|https://www.sigda.org/publications/aspdac-2021-toc/ https://www.aspdac.com/aspdac2023/ ( selected paper 2023)|

|International Symposium on Physical Design|ISPD|http://www.ispd.cc/slides/ispd2021.html (By YuCheng)|

|International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems|TAU||

|International Test Conference|ITC|http://www.itctestweek.org/|

|Workshop on Machine Learning for CAD|MLCAD||

|International Symposium on VLSI Technology, Systems and Application|VLSI-TSA||

|International Symposium on VLSI Design, Automation and Test|VLSI-DAT||

|IEEE Workshop on Signal Propagation on Interconnects|SPI||

|International Symposium on Low Power Electronics and Design|ISLPED||

|IEEE International Symposium on Electromagnetic Compatibility|EMC||

### Journals

1. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

2. IEEE Transactions on Circuits and Systems

3. IEEE Transactions on Very Large Scale Integration Systems

4. IEEE Transactions on Pattern Analysis and Machine Intelligence

5. IEEE Transactions on Neural Networks and Learning Systems

6. IEEE Transactions on Signal Processing

7. IEEE Transactions on Electromagnetic Compatibility

8. IEEE Transactions on Circuits and Systems I: Regular Papers

9. IEEE Transactions on Components, Packaging and Manufacturing Technology 

Reference: https://www.sigda.org/publications/

## Power, IR, and Simulation Paper sharing list

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|GRANNITE Graph Neural Network Inference for Transferable Power Estimation|DAC, Zhang, 2020|attachment:"034_2_pow_toggle.pdf"|attachment:"Paper_Sharing_2020_09_09.pptx"|attachment:"thoughts_notes_20200909.txt"|

|IncPIRD: Fast Learning-Based Prediction of Incremental IR Drop|ICCAD, Ho, 2019|attachment:"Ho_dynIR_ICCAD_2019.pdf"|attachment:"IncPIRD_2020_10_14.pptx"|Note TBD|

|Efficiently Exploiting Low Activity Factors to Accelerate RTL Simulation|DAC, Beame, 2020|attachment:"055_4_simulation.pdf"|SLIDES TBD.||

|Accurate Estimation of Dynamic Timing Slacks using Event-Driven Simulation|ISQED, Garyfallou, 2020|attachment:"dta_Garyfallou_2020.pdf"|attachment:"paper_sharing_09_23.pptx"|attachment:"roadmap_09_23.txt"|

|Multi-Level Timing Simulation on GPUs|ASP-DAC, Schneider, 2018|attachment:"schneider2018.pdf"|SLIDES TBD.||

|GPU-accelerated Time Simulation of Systems with Adaptive Voltage and Frequency Scaling|DATE, Schneider, 2020|attachment:"schneider2020.pdf"|SLIDES TBD.||

|Logic Re-simulation|ICCAD2020_Contest|attachment:"ICCAD2020_ContestProblemSpecification_ProblemC_08102020.pdf"|SLIDES TBD.||

## STA related paper sharing

See: http://10.30.200.21:8088/projects/hongtu-sta/wiki AI section

## 3DIC Symposium

### 2022 International Symposium on 3D IC and Heterogeneous Integration (contact Jun if you need video)

|  |  |  |

|--|--|--|

|Session day1|3DIC architecture, application, and benchmark|attachment:"3DIC_session1.pptx"|

|Session day2|3DIC material, manufacture, integrate methods|attachment:"3DIC_session2.pptx"|

|Session day3|3DIC EMIR and integration details|attachment:"3DIC_session3.pptx"|

|            |Briefing version|attachment:"3DIC_Brief.pptx"|

### 清华大学 3DIC/Chiplet 研讨会  20221028 (Materials from HuiQuan, contact Huiquan or Junc for video recording)

{{thumbnail(3dic_chiplet_qh.png, size=555)}}

|  |  |  |

|--|--|--|

|Session 1|Chiplet_3DIC_发展趋势与挑战|attachment:"Chiplet_3DIC_发展趋势与挑战_中兴微电子吴枫.pdf"|

|Session 2|先进封装工艺技术与湿至失效问题 |attachment:"package_wet_failure.pptx"|

|Session 3|SiC 器件研究中的DTCO问题|attachment:"SiC功率器件的建模技术研究——清华大学（王燕）.pdf"|

|Session 3|从设计视角谈Chiplet的技术挑战 |attachment:"从设计视角谈Chiplet的技术挑战-李翔宇.pdf"|

|Session 4|Multiphysiscs platform (CPS) for chiplet/3dIC (ansys)|attachment:"Tsinghua-ANSS-IC-Tech-Challenges-Opportunities-1028.pdf"|

|Session 4|可重构计算技术加速超大规模AI模型训练与推理修改|attachment:"可重构计算技术加速超大规模AI模型训练与推理修改.pdf" and attachment:"20221028清华交流-可重构计算技术加速超大规模AI模型训练与推理-修改.pdf"|

|Session 5|芯粒(Chiplet)技术发展及应用趋势介绍|attachment:"芯粒(Chiplet)技术发展及应用趋势介绍_for_清华大学集成电路学院.pdf"|

### CCF第2届集成电路设计与自动化学术会议

|  |  |  |  |  |

|--|--|--|--|--|

|CCF第2届集成电路设计与自动化学术会议|CCF 2021|attachment:"CCF第2届集成电路设计与自动化学术会议.pdf"|attachment:"CCF_s.pptx"|Ask jun for detail paper|

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