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Cutting edge paper sharing » History » Revision 8

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jun chen, 03/22/2025 11:00 PM

Cutting edge paper sharing

Software cutting edge

Level Db 介绍 (From WangYang Xiong 202302) leveldb_introduction.pptx

EDA cutting edge

Paper sharing guidelines:

How to do research? Let's learn from Newton: The Discovery That Transformed Pi
https://www.youtube.com/watch?v=gMlf1ELvRzc (Ask Jun for mp4 if you can't bypass gfw)

Read this guideline BEFORE your write slides!!!!! (paper_share_gl.pptx and example: paper_share_gl_exp.pptx)

A brief introduction on paper writing, reviewing procedure (from Nature editor) how_to_write_nature_paper.pptx

Top professor link

Prof. Najm (From Jason) https://www.eecg.utoronto.ca/~najm/pubs.html
Prof. BeiYu https://appsrv.cse.cuhk.edu.hk/~byu/publications.html

OpenRoad EDA tool chain

Main repo: https://openroad.readthedocs.io/en/latest/main/src/psm/README.html

Open EMIR tool: PDNSim

PDNSim is an open-source static IR analyzer. Features:
Report worst IR drop.
Report worst current density over all nodes and wire segments in the power distribution network, g iven a placed and PDN-synthesized design.
Check for floating PDN stripes on the power and ground nets.
Spice netlist writer for power distribution network wire segments.

Top conferences and journals

Conference:
Design Automation Conference DAC https://www.sigda.org/publications/dac-20 19-toc/
Design, Automate, and Test in Europe DATE https://www.date-conference.com/
International Conference on Computer Aided Design ICCAD https://www.sigda.org/publications/iccad-2 019-toc/
Asia South Pacific Design Automation Conference ASPDAC https://www.sigda.org/publications/aspdac-2021-toc/ https://www.aspdac.com/aspdac2023/ ( selected paper 2023)
International Symposium on Physical Design ISPD http://www.ispd.cc/slides/ispd2021.html (By YuCheng)
International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems TAU
International Test Conference ITC http://www.itctestweek.org/
Workshop on Machine Learning for CAD MLCAD
International Symposium on VLSI Technology, Systems and Application VLSI-TSA
International Symposium on VLSI Design, Automation and Test VLSI-DAT
IEEE Workshop on Signal Propagation on Interconnects SPI
International Symposium on Low Power Electronics and Design ISLPED
IEEE International Symposium on Electromagnetic Compatibility EMC

Journals

  1. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  2. IEEE Transactions on Circuits and Systems
  3. IEEE Transactions on Very Large Scale Integration Systems
  4. IEEE Transactions on Pattern Analysis and Machine Intelligence
  5. IEEE Transactions on Neural Networks and Learning Systems
  6. IEEE Transactions on Signal Processing
  7. IEEE Transactions on Electromagnetic Compatibility
  8. IEEE Transactions on Circuits and Systems I: Regular Papers
  9. IEEE Transactions on Components, Packaging and Manufacturing Technology

Reference: https://www.sigda.org/publications/

Power, IR, and Simulation Paper sharing list
GRANNITE Graph Neural Network Inference for Transferable Power Estimation DAC, Zhang, 2020 034_2_pow_toggle.pdf Paper_Sharing_2020_09_09.pptx thoughts_notes_20200909.txt
IncPIRD: Fast Learning-Based Prediction of Incremental IR Drop ICCAD, Ho, 2019 Ho_dynIR_ICCAD_2019.pdf IncPIRD_2020_10_14.pptx Note TBD
Efficiently Exploiting Low Activity Factors to Accelerate RTL Simulation DAC, Beame, 2020 055_4_simulation.pdf SLIDES TBD.
Accurate Estimation of Dynamic Timing Slacks using Event-Driven Simulation ISQED, Garyfallou, 2020 dta_Garyfallou_2020.pdf paper_sharing_09_23.pptx roadmap_09_23.txt
Multi-Level Timing Simulation on GPUs ASP-DAC, Schneider, 2018 schneider2018.pdf SLIDES TBD.
GPU-accelerated Time Simulation of Systems with Adaptive Voltage and Frequency Scaling DATE, Schneider, 2020 schneider2020.pdf SLIDES TBD.
Logic Re-simulation ICCAD2020_Contest ICCAD2020_ContestProblemSpecification_ProblemC_08102020.pdf SLIDES TBD.

STA related paper sharing

See: http://10.30.200.21:8088/projects/hongtu-sta/wiki AI section

3DIC Symposium

2022 International Symposium on 3D IC and Heterogeneous Integration (contact Jun if you need video)
Session day1 3DIC architecture, application, and benchmark 3DIC_session1.pptx
Session day2 3DIC material, manufacture, integrate methods 3DIC_session2.pptx
Session day3 3DIC EMIR and integration details 3DIC_session3.pptx
Briefing version 3DIC_Brief.pptx

清叩大叩 D叩代叩片叩D 3DIC/Chiplet 叩D研叩D (Materials from HuiQuan, contact Huiquan or Junc for video recording)

3dic_chiplet_qh.png
Session 1 Chiplet_3DIC_发展趋势与挑战 Chiplet_3DIC_发展趋势与挑战_中兴微电子吴枫.pdf
Session 2 先进封装工艺技术与湿至失效问题 package_wet_failure.pptx
Session 3 SiC 器件研究中的DTCO问题 SiC功率器件的建模技术研究——清华大学（王燕）.pdf
Session 3 从设计视角谈Chiplet的技术挑战 从设计视角谈Chiplet的技术挑战-李翔宇.pdf
Session 4 Multiphysiscs platform (CPS) for chiplet/3dIC (ansys) attachment:"Tsinghua-ANSS-IC-Tech-Challenges-Opp ortunities-1028.pdf"
Session 4 可重构计算技术加速超大规模AI模型训练与推理修改 可重构计算技术加速超大规模AI模型训练与推理修改.pdf
Session 5 芯粒(Chiplet)技术发展及应用趋势介绍 芯粒(Chiplet)技术发展及应用趋势介绍_for_清华大学集成电路学院.pdf

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Updated by jun chen 3 months ago · 11 revisions