Thermal » History » Version 1
jun chen, 03/29/2025 10:40 PM
1 | 1 | jun chen | # Thermal |
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3 | ## QPACK ( DODOO ) |
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4 | ## Self-heating Effects (SHE) |
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5 | |||
6 | * Fspec: attachment:"self-heating.pptx" |
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7 | |||
8 | ## chip-pkg-system thermal analysis |
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9 | * attachment:"thermal-solutions-for-3d-ic-pkg-and-system.pdf" |
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10 | |||
11 | ## JEDEC Standard (Thermal) |
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13 | https://www.jedec.org/document_search/field_committees/20 |
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14 | |||
15 | * attachment:"JESD15-1_compact_thermal_model_overview.pdf" |
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16 | * attachment:"JESD15-3_two_resistor_compact_thermal_model.pdf" |
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17 | * attachment:"JESD15-4_delphi_compact_thermal_model_guideline.pdf" |
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18 | |||
19 | ## Thermal RC Network Model |
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20 | |||
21 | * attachment:"Application of Thermal Network Approach to Electrical-Thermal Co-simulation and Chip-Package-Board Extraction.pdf" |
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22 | * attachment:"Transient Thermal Analysis for M2 SSD Thermal Throttling Detailed CFD Model vs Network-Based Model.pdf" |
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23 | |||
24 | ## Open Source Reference |
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25 | |||
26 | * Gmsh wiki: http://www.gmsh.info/ |
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27 | * Gmsh/GetDP (ONELAB) Workshop: https://videos.cern.ch/record/2766054 |